Tata Semiconductor OSAT Jagiroad
Tata Electronics' INR 27,000 Crore mega OSAT facility in Jagiroad, Assam, is India's landmark advanced packaging complex capable of packaging 48 million semiconductor chips daily.
Profile & Intelligence Breakdown
Historic Industrial Milestone in Eastern India
The Tata Semiconductor OSAT Facility in Jagiroad, Assam, developed by Tata Electronics, represents an unprecedented INR 27,000 Crore ($3.26B) private-public capital investment. Approved under the India Semiconductor Mission (ISM), this facility establishes the northeastern region of India as a critical node in global semiconductor manufacturing.
Industrial Scale & Packaging Technologies
- Unprecedented Volume: Engineered to process and test up to 48 million semiconductor chips per day at full scale.
- Three Core Packaging Technologies:
- Flip-Chip Assembly: High-density interconnects for high-speed processors and graphics units.
- Fan-Out Wafer Level Packaging (FOWLP): Wafer-level packaging eliminating traditional substrate layers for ultra-thin mobile and wearable chipsets.
- System-in-Package (SiP): Integrating memory, RF modules, and logic processing onto a single miniature module.
- Target Markets: Automotive ECUs, electric vehicle power electronics, artificial intelligence accelerators, and telecommunications 5G infrastructure.
Socioeconomic & Strategic Catalyst
Beyond technical manufacturing prowess, the Jagiroad facility creates over 27,000 direct and indirect high-tech engineering jobs, catalyzing ancillary testing, chemical, and precision engineering industries across Assam and broader India.
Technical Specifications
- node process
- Advanced Flip-Chip, Fan-Out Wafer Level Packaging (FOWLP) & SiP
- fab location
- Jagiroad, Morigaon District, Assam, India
- chip type
- AI Accelerators, Automotive Radar & 5G Baseband Modules