Kaynes Semicon Sanand OSAT
Kaynes Semicon's INR 3,307 Crore state-of-the-art Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat is a cornerstone of the India Semiconductor Mission.
Profile & Intelligence Breakdown
Project Profile & National Importance
Approved under the Union Cabinet's India Semiconductor Mission (ISM) with a capital outlay of INR 3,307 Crore, the Kaynes Semicon OSAT Facility at Sanand, Gujarat, represents one of India's premier high-volume chip packaging, assembly, and testing complexes.
The facility addresses the global demand for back-end semiconductor manufacturing, transforming raw silicon wafers into hardened, production-grade microchips ready for deployment in consumer, industrial, and aerospace electronics.
Production Capacities & Technologies
- Capacity: Designed to process up to 6 million chips per day across varied packaging standards.
- Packaging Formats: Ball Grid Array (BGA), Quad Flat No-leads (QFN), Land Grid Array (LGA), and System-in-Package (SiP).
- Automotive & Industrial Grade: Fully certified for zero-defect automotive electronics, EV battery management systems (BMS), 5G telecom base stations, and smart energy meters.
- Cleanroom Standards: World-class Class 100 and Class 1,000 cleanrooms with automated wire-bonders, die-attach systems, and automated optical inspection (AOI).
Catalyzing India's Silicon Corridor
Situated adjacent to other major investments in the Dholera-Sanand semiconductor cluster, Kaynes Semicon anchors an indigenous supply chain that drastically reduces import reliance on East Asian packaging hubs.
Technical Specifications
- node process
- Multi-Chip BGA, QFN, Flip-Chip & 2.5D Packaging
- fab location
- Sanand, Gujarat, India
- chip type
- Automotive Power Modules, Smart Meter ICs, Industrial IoT